Agenda

The 2026 Texas Semiconductor Summit begins with a Wednesday evening welcome reception, followed by two focused days of programming: Day 1 centered on research, technology, and innovation; Day 2 centered on workforce, ecosystem, and talent pipeline development.

Wednesday | October 21, 2026

Welcome Reception

An informal opening reception for early networking with attendees.
6:00–7:30 p.m.
Reception

Opening Reception

Prefunction
Thursday | October 22, 2026

Day 1 • Research/Technology/Innovation

Day 1 focuses on semiconductor research, applied technology, advanced manufacturing, commercialization, and emerging areas shaping the future of the industry.
7:45–8:30 a.m.
Networking

Breakfast & Registration

Ballroom + Prefunction
8:30–8:35 a.m.
Welcome

Welcome

Speaker:
Joe Elabd, Vice Chancellor for Research, The Texas A&M University System
Ballroom
8:35–9:25 a.m.
Keynote

Keynote

Speaker:
Brian Dunlap, Vice President of 300mm Fab Operations, Texas Instruments
Ballroom
9:25–10:05 a.m.
Fireside

The Semiconductor Industry Outlook: What Changes Next, and Where Texas Fits

Speakers:
Joe Stockunas, President, SEMI Americas Adriana Cruz, Executive Director, Economic Development & Tourism, Office of the Governor of Texas Greg Abbott

This spotlight conversation will connect the national semiconductor industry outlook with Texas's role in the next phase of growth. The discussion will examine what is changing across the industry, which demand drivers appear durable, and what companies are weighing as they make major investment and site-selection decisions. Joe Stockunas and Adriana Cruz will explore the factors that turn investment announcements into successful operating projects--including talent, infrastructure, power, permitting, and broader investment competitiveness--and where Texas is best positioned to lead across the semiconductor value chain.

Ballroom
10:05–10:25 a.m.
Networking

Networking Break

Prefunction
10:25–10:55 a.m.
Plenary

Investing in Texas Semiconductor Leadership: TSIF Update & Outlook

Speaker:
Stephen Davis, Director, Texas CHIPS Office

The Texas Semiconductor Innovation Fund has become a central tool in the state's strategy to strengthen semiconductor research, manufacturing, commercialization, and ecosystem development. This plenary will provide an update on TSIF progress to date, highlight how state investments are being used to build long-term semiconductor capability, and examine the priorities and opportunities that could shape the next phase of Texas's semiconductor strategy.

Ballroom
10:55–11:05 a.m.
Transition

Move to Breakout Rooms

Ross, Corps, or Traditions
11:05–11:55 a.m.

Breakout Block 1

Three concurrent sessions. Choose one session during this block.

Ross/Corps/Traditions
Ross
Wafer/Core Manufacturing

What's Next on the Wafer: Emerging Devices, Materials, and the Processes to Make Them Real

Speakers:
Gil Vandentop, Research Scientist, Texas A&M Semiconductor Institute, The Texas A&M University System Trace Hurd, Vice President, R&D, TEL Tim McArdle, R&D Electronics Engineer, Sandia National Laboratories Chad Wang, Vice President, Components, 1AU Technologies, Inc.

From novel device concepts and emerging materials to the process capabilities required to manufacture them, this breakout examines what may be next on the wafer. Panelists will explore which advances show the most promise, where scaling and integration remain difficult, and what equipment, fabrication, and translational capabilities are needed to move emerging technologies from research toward manufacturable platforms.

Corps
Specialized Technology

Beyond the Die: Advanced Packaging as the New Performance Frontier

Speakers:
Xuejun Fan, Regents' Professor, Lamar University Paul Mosinskis, Solutions Architect, Cadence Design Systems Melbs LeMieux, CEO, Electroninks Dion Antao, Associate Professor, Texas A&M University

As traditional scaling becomes more difficult, packaging and heterogeneous integration are increasingly shaping system-level performance. This breakout will examine how chiplets, advanced interconnects, new materials, design enablement, and integration approaches are changing the role of packaging in semiconductor innovation. Panelists will explore where the greatest technical opportunities remain, what makes advanced packaging solutions difficult to scale, and how design, materials, research, and manufacturing capabilities must come together to move beyond the die.

Traditions
Ecosystem

Supply Chain Fundamentals: Materials, Substrates, Gases, and the Inputs That Actually Matter

Speakers:
Larry Smith, Senior Advisor to the President & CEO, TEL; Member, Texas Semiconductor Innovation Consortium Executive Committee Brent Omdahl, Executive Vice President for Government Affairs, GlobalWafers Co., Ltd. Joseph Rivers, Senior Director, Deposition, Entegris Gaurab Samanta, Senior Principal (Commercial Technology), Air Products

Semiconductor supply chains begin long before a wafer reaches the fab. This breakout will focus on the foundational inputs that determine whether semiconductor manufacturing can actually be built and sustained: critical materials, wafers and substrates, specialty gases, high-purity chemicals, and other industrial essentials. Panelists will examine where supply-chain fragility remains, why purity, qualification, consistency, and capacity matter, and what it takes to build a more resilient supply base capable of supporting semiconductor growth in Texas and across the United States.

11:55 a.m.–1:00 p.m.
Lunch

Lunch

Ballroom
1:00–1:45 p.m.
Panel

Research and Innovation Outlook: From Breakthrough to Real-World Impact

Speakers:
David Staack, Deputy Vice Chancellor for Research, The Texas A&M University System Narasimha Reddy, Department Head of Electrical and Computer Engineering, College of Engineering, Texas A&M University Sujai Shivakumar, Senior Fellow and Director, Renewing American Innovation, Center for Strategic and International Studies Gregory Junek, Head of Growth, Falcomm

Semiconductor breakthroughs do not move from research to manufacturing in a straight line. This conversation will examine where promising advances are emerging, what separates a meaningful technical breakthrough from an interesting laboratory result, and what it takes to move new materials, devices, processes, and enabling technologies toward real-world impact. Bringing together perspectives from academic research, deep-tech commercialization, and the broader innovation ecosystem, panelists will explore what happens after the breakthrough--how promising technologies are validated, de-risked, financed, partnered, and ultimately positioned for industry adoption and scale.

Ballroom
1:45–2:25 p.m.
Fireside

Leadership, Security, and the Future of American Microelectronics

Speakers:
Glenn Hegar, Chancellor, The Texas A&M University System U.S. Rep. Michael McCaul, U.S. Representative, Texas's 10th Congressional District, U.S. House of Representatives

Semiconductors have become central to both American economic competitiveness and national security. This conversation will examine what the United States has learned from the effort to rebuild domestic microelectronics capability, how Texas fits into that national strategy, and what remains unfinished. The discussion will connect federal policy, state investment, research, talent, manufacturing, and supply-chain resilience to the larger question of what it will take to create durable American semiconductor capability.

Ballroom
2:25–2:30 p.m.
Transition

Move to Breakout Rooms

Ross, Corps, or Traditions
2:30–3:20 p.m.

Breakout Block 2

Three concurrent sessions. Choose one session during this block.

Ross/Corps/Traditions
Ross
Wafer

Scaling Under Real Constraints: Yield, Reliability, Power, and Performance

Speakers:
Eddie Piner, Professor, Texas State University & Director, NSF CREST Center Richard Yang, Founder & CEO, Applied Angstrom Technology David Harris, Business Development Manager-Universities and R&D Labs, Plasma-Therm Michael Turner, Director of Device Engineering, NXP Semiconductors

Moving from technical promise to manufacturing reality requires more than strong device performance. This breakout will examine the engineering constraints that determine whether semiconductor technologies can scale--including process control, yield and repeatability, reliability qualification, power/performance tradeoffs, and manufacturability. Panelists will explore what changes between the lab, pilot environment, and production, and what industry needs to see before new technologies become credible at scale.

Corps
Specialized Research/Tech

AI, EDA, and the Next Semiconductor Design Stack

Speakers:
JV Rajendran, Lauderdale Family Engineering Excellence Professor, Texas A&M University Zhuo Li, Vice President of R&D, Cadence Design Systems Vikash Kumar, Senior Verification Architect, Arm Monica Farkash, Fellow, AMD

AI is reshaping how semiconductors are designed--from EDA tools and design workflows to compute architecture and system-level optimization. This breakout will explore how these changes are redefining the semiconductor design stack and what they mean for the next generation of chips.

Traditions
Policy/Economic Development

Building Better Bridges: Research Partnerships That Actually Work

Speakers:
Magdalini Lagoudas, Executive Director, Industry & Nonprofit Partnerships, College of Engineering, Texas A&M University Rich Amato, Associate Vice President of Entrepreneurship, Texas A&M University Girish Wable, Director, Membership & Research Programs, Semiconductor Research Corporation (SRC) Chuck Alpert, Fellow, Cadence Design Systems

This breakout will examine what it takes to make industry-university research partnerships work in practice. Rather than simply calling for more collaboration, panelists will discuss how partners align research questions with industry needs, set realistic expectations, structure repeatable models for engagement, navigate IP and sponsored research considerations, use consortia and shared infrastructure effectively, and create stronger pathways for faculty, students, and companies to work together. The conversation will surface concrete models, lessons learned, and practical ways to reduce friction between research ambition and industry execution.

3:20–3:40 p.m.
Networking

Networking Break

Prefunction
3:40–4:30 p.m.

Breakout Block 3

Three concurrent sessions. Choose one session during this block.

Ross/Corps/Traditions
Ross
Manufacturing

From Blueprint to Fab: What It Takes to Bring Semiconductor Manufacturing Online

Speaker:
Adrian Franco, Senior Client Consultant, Olsson Matt Cannon, Regional Project Manager, Austin Commerical Johnnie Cain, Front-End Operations Training Program Manager, NXP Semiconductors

Bringing a semiconductor fab online requires far more than constructing a building. This breakout will examine the full delivery chain—from translating owner requirements into site and infrastructure plans through design and engineering, construction and cleanroom delivery, tool and process-system integration, commissioning, turnover, and operational startup. Drawing on perspectives from fab operations, design and engineering, semiconductor construction, critical environments, and infrastructure, panelists will explore the coordination, sequencing, and technical decisions required to move from facility concept to an environment truly ready to support people, tools, and production. The conversation will examine where projects most often encounter risk or rework, what owners need from delivery partners at each stage, and how teams can better bridge the gap between construction completion and manufacturing readiness.

Corps
Specialized Technology

Entangled: What Quantum Will Need from Semiconductors

Speakers:
Dilma Da Silva, Regents Professor, Texas A&M University Percy Gilbert, Senior Vice President, Engineering, SkyWater Technology Xiuling Li, Truchard Foundation Chair Professor & Co-Director, Texas Quantum Institute, University of Texas at Austin

Quantum technologies ultimately depend on the ability to build, integrate, test, and scale extraordinarily complex physical devices. This breakout will examine the semiconductor capabilities required to move quantum systems toward greater scale and practical application--from materials and device fabrication to foundry access, process integration, packaging, metrology, reliability, and the infrastructure needed to support increasingly complex quantum systems. Bringing together perspectives from quantum research, semiconductor devices, and advanced manufacturing, panelists will explore what is possible today, what remains technically difficult, and where advances in semiconductor capability may determine how quickly quantum technologies move from research toward real-world systems.

Traditions
Specialized Technology

Space-Enabled Semiconductor Materials: From Microgravity Research to Manufacturing Potential

Speakers:
Kevin Engelbert, Portfolio Manager for In Space Production Applications (InSPA), NASA Atul Kumar, Vice President of Semiconductors, SpaceForge Matt Ondler, President & Chief Strategy Officer, Aegis Aerospace, Inc. Henry Clark, Radiation Effects Facility Manager, Cyclotron Institute, Texas A&M University

Can microgravity and in-space production create meaningful advantages for semiconductor materials--and what evidence would industry need before those advantages matter? This session will examine what microgravity research and emerging flight demonstrations may reveal, how potential materials improvements would need to be characterized and validated, and what technical, operational, and commercial hurdles remain between promising experiments and viable manufacturing. The discussion will also explore where Texas-based space and semiconductor capabilities could intersect.

4:30–4:35 p.m.
Transition

Return to Ballroom

Ballroom
4:35–5:15 p.m.
Closing Plenary

Across the Stack: What We Heard, What Connects, and What Comes Next

Speaker:
Steve Putna, Associate Vice Chancellor for Research & Director, Texas A&M Semiconductor Institute, The Texas A&M University System Adrian Franco, Senior Client Consultant, Olsson Larry Smith, Senior Advisor to the President & CEO, TEL; Member, Texas Semiconductor Innovation Consortium Executive Committee Magdalini Lagoudas, Executive Director, Industry & Nonprofit Partnerships, College of Engineering, Texas A&M University Xuejun Fan, Regents' Professor, Lamar University

After a full day of conversations spanning semiconductor research, manufacturing, design, packaging, supply chains, quantum technologies, infrastructure, and industry partnerships, this closing plenary will bring several of those threads back together. Selected breakout moderators will share the strongest signals from their sessions and join Texas A&M Semiconductor Institute Director Steve Putna for a closing conversation on what Texas must connect, build, and prioritize next.

Ballroom
5:15 p.m.
Closing

Closing Remarks

Ballroom
5:30 p.m.
Reception

Reception

Ballroom + Prefunction
Friday | October 23, 2026

Day 2 • Workforce/Ecosystem/Talent Pipeline

Day 2 focuses on talent pipelines, education and training pathways that sustain long-term semiconductor growth in Texas.
7:45–8:30 a.m.
Networking

Breakfast & Networking

Ballroom + Prefunction
8:30–8:35 a.m.
Welcome

Day 2 Frame

Speaker:
Steve Putna, Associate Vice Chancellor for Research & Director, Texas A&M Semiconductor Institute, The Texas A&M University System
Ballroom
8:40–9:15 a.m.
Keynote

Building the Texas Talent Engine

Speaker:
Mary York, Division Director for Workforce Development, Texas Workforce Commission
Ballroom
9:20–10:10 a.m.
Panel

Critical Semiconductor Workforce Needs: Closing Today's Gaps, Building Tomorrow's Talent

Speakers:
Laura Marmolejo, Dean, Advanced Manufacturing, Austin Community College Nahum Pacheco, Assistant Commissioner for Workforce Education, Texas Higher Education Coordinating Board Ashton Bellows, Chief Financial Officer, Sherman Economic Development Corporation Eden Zielinski, Assistant Director, North Texas Semiconductor Institute, University of Texas at Dallas

Texas’s semiconductor growth is already putting pressure on technician and technical talent pipelines, while changing technologies and manufacturing requirements are reshaping the skills the workforce will need next. This panel will examine where the most urgent workforce gaps exist today, what can be addressed through education, upskilling, and reskilling, and how higher education, economic development, workforce organizations, and industry partners can better coordinate their response. The discussion will give attendees a clearer view of today’s constraints, tomorrow’s talent needs, and the partnerships Texas must strengthen to build a sustainable semiconductor workforce.

Ballroom
10:10–10:20 a.m.
Networking

Networking Break

Prefunction
10:20–10:55 a.m.
Panel

Great Transitions: Turning Military Talent into Semiconductor Careers

Speakers:
Clay Huber, Director, Workforce Development, Texas A&M Semiconductor Institute, The Texas A&M University System Tom Palladino, Executive Director, Texas Veterans Commission Scott Efflandt, Director, Military Talent Pipeline Development, Texas A&M University-Central Texas Yashika Neaves, Chief, Strategic Plans & Initiatives, United States Department of War

Texas has one of the nation's largest military-connected talent pools, with technical experience, leadership skills, and mission-oriented problem solving that can translate directly into advanced manufacturing and semiconductor careers. This conversation will examine how military experience can be translated into civilian opportunities, where credentialing and employer recognition still create barriers, and how state agencies, universities, employers, and transition programs can build clearer pathways into high-demand technical roles.

Ballroom
11:00–11:40 a.m.
Fireside

Connecting the Dots: Linking NNME and the Southern Node to Texas's Semiconductor Workforce Strategy

Speaker:
Alyssa Reinhart, Director of Workforce Development, Texas Institute of Electronics Mike Glavin, Program Director, Workforce Development, SEMI Foundation

The National Network for Microelectronics Education and its Southern Node are being developed within a much larger Texas workforce ecosystem. This session will introduce those efforts while examining how national and regional microelectronics education initiatives can connect more effectively with Texas employer demand, higher education pathways, state workforce priorities, and emerging training programs. The discussion will focus on reducing fragmentation, strengthening coordination, and using these networks to support a more connected and responsive semiconductor talent pipeline across the state.

Ballroom
11:40 a.m.–12:25 p.m.
Closing Plenary

From Gaps to Action: What Texas Must Build Next

Speakers:
Cindy Lawley, Assistant Vice Chancellor for Engineering Academic, Outreach, and Workforce Development Programs, Texas A&M Engineering Experiment Station, The Texas A&M University System Edgar Padilla, Executive Fellow, Semiconductor Manufacturing, City of Austin Economic Development Alyssa Reinhart, Director of Workforce Development, Texas Institute of Electronics Clay Huber, Director, Workforce Development, Texas A&M Semiconductor Institute, The Texas A&M University System

Texas has significant semiconductor workforce assets, but building a truly competitive talent ecosystem will require more than isolated programs and individual successes. This closing conversation will synthesize the day's discussions, examine what Texas can learn from other semiconductor hubs, identify where the state is strongest and where meaningful gaps remain, and translate those insights into a forward-looking workforce agenda. Panelists will consider what employers, education partners, workforce organizations, and public agencies should prioritize next--and what progress Texas should be able to demonstrate by the 2027 Summit.

Ballroom
12:25–12:30 p.m.
Closing

Closing Charge & Adjourn

Ballroom
12:30 p.m.
Lunch/Departures

Grab-and-Go Boxed Lunch/Informal Networking/Departures

Ballroom + Prefunction
Agenda subject to change.

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